In this paper, we report and discuss the results of the surface treatment, using an atmospheric pressure dielectric barrier discharge (DBD), of selected polymer films which have no bonded oxygen in their intrinsic structures. Contact angle, X-ray photoelectron spectroscopy (XPS) and scanning electron microscopy (SEM) data are presented with respect to post-treatment characterisation and the dependence of these outcomes on the salient processing variables: energy dissipated, exposure duration and inter-electrode gap. Under the treatment conditions used, remarkably uniform treatment and markedly stable modified surface properties result from the test surfaces exposed to the discharge, even at transit speeds simulating those associated with continuous on-line processing. The DBD system thus described, provides chemically mild and mechanically non-destructive means of altering surface properties, targeting improved surface characteristics and potentially better application performance.

In this paper, we report and discuss the results of the surface treatment, using an atmospheric pressure dielectric barrier discharge (DBD), of selected polymer films which have no bonded oxygen in their intrinsic structures. Contact angle, X-ray photoelectron spectroscopy (XPS) and scanning electron microscopy (SEM) data are presented with respect to post-treatment characterisation and the dependence of these outcomes on the salient processing variables: energy dissipated, exposure duration and inter-electrode gap. Under the treatment conditions used, remarkably uniform treatment and markedly stable modified surface properties result from the test surfaces exposed to the discharge, even at transit speeds simulating those associated with continuous on-line processing. The DBD system thus described, provides chemically mild and mechanically non-destructive means of altering surface properties, targeting improved surface characteristics and potentially better application performance.

In this paper, continuing previous work, we report on the installation and the testing of an experimental dielectric barrier discharge (DBD) reactor run in a controlled atmospheric pressure gaseous environment other than air. Here, the effects of a N₂-DBD treatment on the surface of a test polymer material (UHMW polyethylene) are examined, reported, discussed and compared to results obtained previously following air-DBD treatment. Surface analysis and characterization were performed using x-ray photoelectron spectroscopy, contact angle measurement and scanning electron microscopy before and following the DBD processing described. The discharge parameters used were correlated with the changes in the surface characteristics found following DBD treatments of various durations in a nitrogen atmosphere. The work focuses on the control of the gaseous environment supporting the discharge and on the possibility of overcoming the potentially dominant effect of reactive oxygen-related species, derived from any residual air present. The results obtained underline the very high reactivity of such species in the discharge, but are encouraging in respect of the possibility of the implantation or generation of functional groups other than oxygen-related ones at the surface of interest. The processing conditions concerned simulate 'real' continuous high speed processing, allowing the planning of further experiments, where various gaseous mixtures of the type X + N₂ will be used for controlled surface functionalization.

Adhesion of epoxy resins on copper foils for printed circuit board (PCB) applications is improved by nearly a factor of 5, using surface cleaning and deposition of a 15-nm-thick film in a low-pressure remote plasma-enhanced chemical vapor deposition process. The cleaning pretreatment, using an N₂–O₂ oxidizing gas mixture with moderate heating (343 K), gives the best results. This pretreatment removes the carbonaceous contaminants present on the topmost surface of the sample and slightly oxidizes the copper into CuO. This oxide is then reduced during the deposition treatment, presumably by reaction with the aminopropyltrimethoxysilane (APTMS) precursor. The surface roughness is unchanged after treatment, thereby showing that the improvement of the copper/epoxy adhesion is only due to the chemistry of the plasma coating. Applying these results to dielectric barrier discharges allows us to achieve the same level of adhesion, which, therefore, does not depend on the process.

An environmentally friendly plasma amination process for the activation of polymers prior to electroless metallization using dielectric barrier discharges (DBD) at atmospheric pressure was investigated. One focus of the work was on the correlation between plasma parameters and palladium coverage on the polymer on the one hand and the palladium coverage and adhesion of a galvanic copper metallization on the other hand. Using XPS spectroscopy it was found that a DBD treatment of polyimide (PI) films with mixtures of N₂ and H₂ leads to considerably higher Pd surface concentrations than on untreated reference samples or foils treated in air-DBD. The Pd coverages achieved result in peel strengths of a copper metallization of up to 1.4 N · mm⁻¹.

We report on the preparation of amphiphilic diblock copolymers containing a hydrophilic segment, poly(acrylic acid)(PAA), and a polystyrene hydrophobic part. We analysed, by means of contact-angle measurements, how the hydrophilic segments usually bury themselves under the hydrophobic when exposed to air to reduce the surface free energy of the system. In contrast, in contact with water, the hydrophilic blocks have a tendency to segregate to the interface. We first describe the parameters that control the surface reconstruction when the environmental conditions are inversed from dry air to water vapour. Then, annealing time, temperature, composition and size of the diblock copolymers, and size of the matrix that influenced the surface migration process are the main parameters also considered. Finally, the density of the carboxylic functions placed at the surface was determined using the methylene blue method.

The surface tension of a model, water-based, flexographic printing ink was measured at a range of surfactant concentrations along with the equilibrium contact angle formed with polymer substrates. The surface excess of surfactant at each concentration was calculated using the Gibbs adsorption isotherm and assumed equal to the concentration of surfactant at the interface. The change in the surface tension of the ink formulation was assumed to be determined entirely by the surface concentration of surfactant. This allowed the estimation of the surface tension at the solid–liquid and solid–vapour boundaries when in contact with substrate based on the values obtained for pendant drops. The associated polar and dispersive contributions to the surface tension were then calculated using the Young–Dupré equation. The values of the polar and dispersive surface tension components extracted in this manner were compared with those calculated using the approach of van Oss, Chaudhury and Good. The use of surface excess in estimating the contributions to surface tension was found to give far better agreement with experimental data than the van Oss approach which is intended for use with pure liquids.